BSY-1000 Automatic Machine-Vision Mold Monitor fo | RFQ Sourcing Details

Product overview The BSY-1000 is an automatic, computerized mold monitor intended to observe mold and equipment conditions during production.

It uses machine-vision image comparison and real-time image-data calculations to identify listed conditions such as incomplete part ejection, incomplete retraction of cores or ejector pins, robotic-arm position issues, misplaced inserts, material shortages or excesses, and abnormal mold temperatures.

Its purpose is to help operators detect in-mold anomalies that could lead to mold damage. The system is described for use with injection molding machines, presses, and die-casting machines. Listed application fields include automotive components, 3C accessories, home appliances, and other manufacturing environments.

Thermal-imaging and smart-camera functions are described, along with guration The stated controller configuration includes a 13.3-inch screen, J6412 CPU with a listed 2.6 GHz base frequency, 4 GB memory, 64 GB M.2-2280 storage, Linux operating system, and In , 1920 × 1080 resolution, 20 frame rate, and a 1/2.8-inch CCD sensor.

The equipment specification states a total weight of 1.6 kg, while the packaged listing states a gross weight of 11 kg and carton dimensions of 43 × 26 × 32 cm;buyers should reconcile these figures before ordering.

Software and operating functions Listed functions include color image display, automatic generation of detection areas, brightness compensation, motion correction for mold-opening stroke deviation, one-click program operation, touch control, expandable software functions, configurable communication I/O, and networked data management.

Server-side functions are described as live video, playback, data return, statistics, reports, and early-warning configuration.

The system also lists SMS exception notifications, to confirm Before purchase, confirm the exact hardware and software generation included under model BSY-1000, because third-, fifth-, and sixth-generation mold monitors are referenced without a clear mapping to this configuration.

Ask which cameras, thermal-imaging components, biometric functions, . Provide the target machine model, controller interface, voltage, mold-opening sequence, available mounting space, inspection objectives, cycle time, lighting conditions, required I/O signals, and plant-network requirements.

Confirm the interface standard and whether additional sensors, lighting, brackets, licenses, servers, or integration work are required.

Also verify the achievable inspection timing, alarm logic, detection-area setup, image retention, user-permission controls, supported rification of the stated device weight versus packaged gross weight.

Confirm the applicable CE documentation and ISO management-system certificate for the supplied unit and manufacturing facility, as well as the scope and conditions of the listed one-year warranty and after-sales support.